10 datasets found

The aim of this doctoral work is to study the new kind of interconnections like TSV (Through Silicon Via), redistribution lines (RDL) and copper pillars used in 3D...

The power electronics field is struggling for new material, technological and conceptual evolutions. These changes induce breakthrough in the conventional design and...

Nowadays, 2D integration shows serious limitations when it comes to manufacturing devices with increased functionality and performance. In this context, 3D integration...

This PhD work deals with characterization and electrical modeling of interconnection networks for 3D stacking of advanced integrated circuits. First, characterization...

Multispectral imaging is used to improve target detection and identification in monitoring applications. It consists in analyzing images of the same scene...

3D technology promises energy-efficient heterogeneous integrated systems, which may open the way to thousands cores chips. Silicon dies containing processing elements...

Direct wafer bonding refers to a process by which two mirror-polished wafers are put into contact and held together at room temperature without any additional...

With the increasing density of features in the various integrated circuits surrounding us, 3D integration (stacking chips) becomes essential. One key point of such...

The goal of this thesis is to build and characterize nanowire based field-effect-transistors. These FET will have either back or wrapping gate using standard CMOS...

The fabrication of microelectronic devices using 3D integration technologies requires a good knowledge of mechanical issues. Indeed, the thin films that are integrated...