The fabrication of microelectronic devices using 3D integration technologies requires a good knowledge of mechanical issues. Indeed, the thin films that are integrated have various thermomechanical properties and are deposited onto a substrate that is thinned in order to carry out the interconnections. The level of stresses and strains in devices has to be strictly controlled during their processing.The goal of this work is to exploit the characterization techniques available at the LETI and to couple them with modeling tools to address this issue. This coupling is used to control the mechanical behavior of a complex stack at each step of its fabrication. The experimental techniques that are used are non-destructive. The modeling tools take into account the elastic and thermal properties of each material involved in the stack, and also the intrinsic strains caused by the deposition of each layer. Coupled methodologies have been carried out to evaluate these input data. From a material database, a tool to predict the mechanical behavior of a multilayer stack was developed and validated experimentally. It enables to predict the level of strain and stress of the stack. Mechanical predictions enable to guide the selection of materials in order to improve the devices integrity and optimize their fabrication. Reliability issues that occur in the long term, due to a significant level of stress and strain can also be anticipated
