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Eliminating speed penalty in ECC protected memories
ISBN 978-1-61284-208-0 -
Effect of Au and Ni layer thicknesses on the reliability of BGA solder joints
ISBN: 1-4244-0107-0 -
Test algorithms for ECC-based memory repair in nanotechnologies
ISBN 978-1-4673-1073-4 -
Back-End Dielectrics Reliability under Unipolar and Bipolar AC-Stress
International audience -
Through-Silicon-Via Built-In Self-Repair for Aggressive 3D Integration
ISBN 978-1-4673-2084-9
