Effect of Au and Ni layer thicknesses on the reliability of BGA solder joints
Data and Resources
Additional Info
| Field | Value |
|---|---|
| Source | Proc. of Electronics Materials and Packaging, 2005. EMAP 2005. International Symposium on |
| Author | Alam, M.O., Chan, Y.C., Rufer, Libor |
| Maintainer | CCSD |
| Last Updated | May 14, 2026, 09:29 (UTC) |
| Created | May 14, 2026, 09:29 (UTC) |
| Identifier | hal-00079018 |
| Language | en |
| contributor | City University of Hong Kong [Hong Kong] (CUHK) |
| coverage | Tokyo, Japan |
| creator | Alam, M.O. |
| date | 2005-05-14T00:00:00 |
| harvest_object_id | e3179009-0cf3-42ce-89da-8015236f6a91 |
| harvest_source_id | 3374d638-d20b-4672-ba96-a23232d55657 |
| harvest_source_title | test moissonnage SELUNE |
| metadata_modified | 2026-03-26T00:00:00 |
| relation | info:eu-repo/semantics/altIdentifier/doi/10.1109/EMAP.2005.1598241 |
| set_spec | type:COMM |