Through-Silicon-Via Built-In Self-Repair for Aggressive 3D Integration
Data and Resources
Additional Info
| Field | Value |
|---|---|
| Source | IEEE 18th International On-Line Testing Symposium (IOLTS) |
| Author | Nicolaidis, M., Pasca, V., Anghel, Lorena |
| Maintainer | CCSD |
| Last Updated | May 10, 2026, 11:16 (UTC) |
| Created | May 10, 2026, 11:16 (UTC) |
| Identifier | hal-00841561 |
| Language | en |
| contributor | Techniques de l'Informatique et de la Microélectronique pour l'Architecture des systèmes intégrés (TIMA) ; Université Joseph Fourier - Grenoble 1 (UJF)-Institut polytechnique de Grenoble - Grenoble Institute of Technology (Grenoble INP)-Centre National de la Recherche Scientifique (CNRS) |
| coverage | Sitges, Spain |
| creator | Nicolaidis, M. |
| date | 2012-06-27T00:00:00 |
| harvest_object_id | 33f718ea-a50b-44c2-a628-3e898f74a6e0 |
| harvest_source_id | 3374d638-d20b-4672-ba96-a23232d55657 |
| harvest_source_title | test moissonnage SELUNE |
| metadata_modified | 2026-03-26T00:00:00 |
| relation | info:eu-repo/semantics/altIdentifier/doi/10.1109/IOLTS.2012.6313847 |
| set_spec | type:COMM |