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A 3D IC BIST for pre-bond test of TSVs using Ring Oscillators
International audience -
An RF BIST Architecture for Output Stages of Multistandard Radios
Article accepté pour publication -
LMS-Based RF BIST Architecture for Multistandard Transmitters
Article accepté pour publication -
Pseudorandom Functional BIST for Linear and Nonlinear MEMS
ISBN: 3-9810801-1-4 -
Ratio de performance d'algorithmes de bin packing en deux dimensions pour des...
International audience -
BIST for Logic and Local Interconnect Resources in a Novel Mesh of Cluster FPGA
ISBN : 978-1-4799-1583-5 -
Built-In Self-Test for Manufacturing TSV Defects before bonding
International audience
