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Starch nanoparticules for ecoefficient flexible barrier paper packaging
The present work investigates the potential of starch nanocrystals (SNCs) for industrial scaled-up preparation and use. An extensive characterization (morphology,... -
Packaged antenna solution for the Radio front end @ 60 GHz based on a dielect...
International audience -
Low-cost and versatile thermal test chip for power assemblies assessment and ...
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Study of the robustness of SiC JFET transistors under electrical stress
The work presented in this thesis was conducted between SATIE and LTN IFSTTAR laboratories. It focuses on the study of the robustness of SiC power components subjected... -
SiC Schottky diodes for harsh environment space applications
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Processing of alternative die attaches techniques for high temperature applic...
More electric aircaft projects lead to the increasing use of power electronic systems including in high temperature areas. Classical power modules must be adapted to... -
Le packaging au service de la santé publique
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High-temperature die-attaches for SiC power devices
10 pages - ISBN: 978-161284167-0 -
Starch Nanocrystals: Preparation and Application to bio-based flexible packaging
La thèse est rédigée en anglais. Cependant chaque partie est résumée en francais en début de chapitre. -
Co-design of integrated Power Amplifier-Antenna Modules on Silicon Technologi...
Within the wireless digital communication framework, data exchange speed (throughput) still remains as one of the characteristics that limits the system performance.... -
Investigations on electromagnetic noises and interactions in electronic archi...
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Investigating consumers' representations of beers through a free association ...
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Design and implementation of reconfigurable antennas based on MEMS integratio...
The work presented in this PhD thesis is a contribution for the study of reconfigurable antennas based on MEMS integration for 3D heterogeneous millimeter... -
Sensor Conditioning for Ultrasonic Remote Sensing Immersion
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From environmental assessment to usage centered eco-design: taking into accou...
International audience -
Carbon nanotube bumps for the flip chip packaging system
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A 0-level packaged RF-MEMS switched wideband GaAs LNA MMIC
This paper focuses on the design of an RF-MEMS Dicke switched wideband LNA realized in a GaAs MMIC process that also includes a BCB cap type of wafer-level package.... -
Monitoring the extraction of additives and additive degradation products from...
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Le vin en bouteille : de l'emballage au packaging. Lecture sémiotique et mark...
International audience
