More electric aircaft projects lead to the increasing use of power electronic systems including in high temperature areas. Classical power modules must be adapted to this harsh environment: SiC devices are now commercially available but the packaging of the dies must be completely changed. This thesis focus on alternative die-backside attaches aand particularly on sintering and Transient Liquid Phase Bonding (TLPB) which are classified as Low Temperature Joining Techniques. In the first part, importance of power electronic systems for high temperature applications is given. Theoretical considerations about physical mechanisms (diffusion, wetting) involved in sintering and TLPB are described precisely. The purpose of the second part of this thesis is to establish a realiable protocole of die-attach using commercial silver nanopaste.the method has been optimized for different sizes of devices. Caracterization was provided using optical pictures and shear-test results. The third chapter of this work is about the realization of die-attaches using TLPB method. A description of surfaces preparation is given and diffusion results are discussed using SEM and optical pictures. This work is very experimental because sintering classical procedure must be adapted and optimized for each kind of devices. This thesis has clealy shown the difficulties for surfaces preparation.
