In microelectronics, some devices (MEMS) need to be encapsulated by a protective layer for optimal performances. This technique involves a patterned layer made of BCB polymer (benzocyclobutene). This layer is between a nickel film and a silicon substrate. A good understanding of those two interfaces is of first importance. The aim of this thesis is the mechanical characterization of the fracture energy of the Ni/BCB and BCB/Si patterned interfaces. Two mechanical tests (the 4-points bending test and the wedge test) have been selected in that purpose. Analytical models are well established to analyze those tests but for continuous interfaces. With patterned ones, those models are limited and do not take into account all the size effects and the geometrical effects induced by the patterning. A modified analytical model is proposed for the wedge test in order to overcome these limitations. Numerical studies are also carried out to complement the study. Patterning effects such as the size of the patterns and the space between them are enhanced.
