Study of adhesion and decohesion of thin films...
URL: https://theses.hal.science/tel-00805111
Dataset description:
In microelectronics, some devices (MEMS) need to be encapsulated by a protective layer for optimal performances. This technique involves a patterned layer made of BCB polymer...
Source: Study of adhesion and decohesion of thin films for MEMS' encapsulation
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Additional Information
| Field | Value |
|---|---|
| Data last updated | unknown |
| Metadata last updated | May 9, 2026 |
| Created | unknown |
| Format | HTML |
| License | https://about.hal.science/hal-authorisation-v1/, info:eu-repo/semantics/OpenAccess |
| Created | 1 week ago |
| Id | 9861c4fc-e2ef-4336-a135-3c0f26cb2668 |
| Package id | oai-hal-tel-00805111v2 |
| Resource type | HTML |
| State | active |