True 3D Packaging Solution for Stacked Vertical Power Devices
Data and Resources
Additional Info
| Field | Value |
|---|---|
| Source | The 25th International Symposium on Power Semiconductor Devices and ICs. (ISPSD 2013) |
| Author | Rouger, Nicolas, Clément, Jean-Paul, Benaissa, L., Widiez, Julie, Imbert, B., Gaude, Victor, Verrun, S., Crébier, Jean-Christophe |
| Maintainer | CCSD |
| Last Updated | May 10, 2026, 09:19 (UTC) |
| Created | May 10, 2026, 09:19 (UTC) |
| Identifier | hal-00843807 |
| Language | en |
| contributor | Laboratoire de Génie Electrique de Grenoble (G2ELab) ; Université Joseph Fourier - Grenoble 1 (UJF)-Institut polytechnique de Grenoble - Grenoble Institute of Technology (Grenoble INP)-Institut National Polytechnique de Grenoble (INPG)-Centre National de la Recherche Scientifique (CNRS) |
| coverage | Kanazawa, Japan |
| creator | Rouger, Nicolas, Clément, Jean-Paul |
| date | 2013-05-26T00:00:00 |
| harvest_object_id | 065e968d-e724-4749-be55-ee5a6549db11 |
| harvest_source_id | 3374d638-d20b-4672-ba96-a23232d55657 |
| harvest_source_title | test moissonnage SELUNE |
| metadata_modified | 2025-09-27T00:00:00 |
| set_spec | type:COMM |