-
Post Etch Plasma Treatments used for Porous SiOCH Materials Integration for I...
The decrease of the integrated circuits size lets to increase the performances and reduce the manufacture costs. However, this shrink causes the preponderance of... -
Study of resistivity and electromigration behaviour in interconnections inten...
The resistivity and reliability of copper in interconnections of the integrated circuits for the 90 nm - 32 nm nodes were studied. The context, the processing of the... -
Plasma cryogenic etching of silicon: from the early days to today's advanced ...
International audience -
Plasma etching and treatment of organosilicon material SiOC(H) by plasma for ...
This study concerns the plasma etching of hybrid materials SiOC(H) which are new emergent compounds. Their adjustable properties between organic and inorganic...
