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Three dimensional Stacking of Integrated circuits
During 50 years, semiconductor technology has been evolving in exponential rates in both productivity and performance. By following a steady technological path that... -
Toward single nano-object measurement, fabrication of nanogaps by electromigr...
We have studied the formation of nanogaps by électromigration of gold nanowires. Electromigration relies on large current densities to break a thin and narrow metallic... -
Contrôle de nano-antennes optiques par une commande électrique : tuner plasmo...
Optical nano-antennae are the new class of components to control light/matterinteraction at the nanoscale. These devices are operating in the visible to near... -
Study of resistivity and electromigration behaviour in interconnections inten...
The resistivity and reliability of copper in interconnections of the integrated circuits for the 90 nm - 32 nm nodes were studied. The context, the processing of the... -
Global existence for diffusion-electromigration systems in space dimension th...
International audience -
Electronic read-out of a single nuclear spin based on a molecular spin transi...
This PhD thesis is at a cross-road between three different fields : the spintronics which uses the spin degree of freedom of the electron to build new devices ; the... -
Out-of-equilibrium dynamics: examples in surface science
In this dissertation, the out-of-equilibrium dynamics of crystalline surfaces have been studied.We have emphasized on solid state dewetting of single crystalline thin... -
CARACTERISATION EXPERIMENTALE ET SIMULATION PHYSIQUE DES MECANISMES DE DEGRAD...
The assemblies PoP (Package on Package) can greatly increase the integration density of microelectronic circuits and systems, by vertically combining discrete... -
Elaboration de nouvelles méthodologies d'évaluation de la fiabilité de circui...
This work is a contribution to the study of the synergy between accelerated aging and the evolution of robustness to single event effects for advanced MOS...
