Recent advances in telecommunications require new components that can operate at high frequencies and now, electronic requires high quality components. The main purpose of this work is the design, micro-fabrication and characterization of a micro-integrated inductor using properties of a relatively thick layer of magnetic material. As coiled structures are difficult to integrate a planar structure was chosen. Two kinds of devices have been made: a device consisting of one spiral on a layer of magnetic material and another consisting of one spiral sandwiched between two layers of magnetic material. The simulation studies show very good results confirmed by characterizations. Several high frequencies (using a vector analyzer) and low frequencies (using a LCRmeter) characterizations were made. Results show that the inductance value is multiplied by two in the case of a structure with one layer of magnetic material and by a factor close to the permeability of magnetic material in the case of a double layer structure. In addition, a high current characterization technique using a bias tee and a technique for determining the permeability of the magnetic material using a combination of measurement results and simulation have been implemented. The integration of passive components such as inductor with relatively thick magnetic layers is made possible by the use of microelectronic and micro-machining techniques
