The main objective of this thesis is to study the electronics’ cards reliability. These cards are used in many fields, such as automotive, aerospace, telecommunications, medical. They provide all necessary electronic functions for well functioning of an electronic system. Electronic cards are undergoing various extreme stresses (mechanical, electrical, and thermal) when handling and commissioning. These stresses are due to drops, vibration and temperature variations. They may cause solder joints failures’ of electronic components. This may causes the failure of the entire electronic system. The objectives of this work are: To develop a numerical model to simulate the drop test of an electronic card; To predict the fatigue life of solder joints in uncertain environment of the variables; To develop a reliability-optimization method to determine the optimal geometry providing a targeted reliability level of an electronic card; To apply a new hybrid optimization method in order to determine the optimal geometry both of an electronic card and a solder joint.
