The aim of this work is to study the cooling of power semiconductors by the use of integrated micro heat exchangers. The heatsink is not placed under the component case but is directly integrated under the silicon chip. Thus, in a first time, electrical, thermal and technological characteristics of power components are renûnded. Two cooling principles hâve been retained : single phase forced convection and two-phase forced convection. Single phase forced convection is studied in the second chapter. The most adéquate corrélations for the calculation of the heat transfer coefficient are extracted from a bibliography review. Then, a conception methodology is established to optimise the heatsink sizes in order to minimise its thermal résistance and the pumping energy. Finally, the validity of the study is checked with measurements realised on single chip prototypes. A similar way is employed to study two-phase forced convection. Two-phase heat transfer, pressure drop and critical heat flux are obtained from a bibliographical review. From thèse instructions, a conception methodology is established, methodology which is also checked by measurements realised on prototypes.
