The work of this thesis is part of a larger project, the project 3D-IDEAS, funded by the ANR. The purpose of this project is to establish the complete chain of integrated circuits built upon 3D technology. Power densities in these circuits are exacerbated, thus problems related to temperature, such as electromigration, mismatch of bias currents and voltages, etc., arise and might have critical effects on the circuit behavior. The high cost of these circuits requires the designer to validate the electro-thermal behavior of circuits prior to manufacturing. To meet this need, an accurate and reliable electro-thermal simulator should be available. Moreover, due to the extreme complexity of these circuits, it is wise for such a simulator to be compliant with high level modeling approach. The objective of this thesis is to develop such a simulator. The proposed solution integrates the simulator in the broadly used CAD environment for integrated circuits Cadence®. The need of accurate results led us to develop a new methodology specific to high level electro-thermal modeling. This manuscript is split in two major parts. In the first one, the approach to implement the simulator is detailed. Then, in the second part, the operation principle of the simulator and the modeling method implementation are detailed and validated.
