With low energy consumption, non-volatile memories are interesting for portative applications (USB, mobile phone, laptop …). The Flash memory technology is reaching its physical boundaries and needs to be replaced. New materials and architectures are currently investigated. Oxide Resistive Random Access Memory (OxRRAM) is considered as a good candidate. It is based on a M-O-M (Metal-Oxide-Metal) stack. The information is stored using an electric field or a current that modulates the resistance of the oxide. A better understanding of the resistance switching mechanism is required in order to control the performances of the devices. We investigate the dielectric breakdown that activates the resistance switching properties. Physico-chemical characterization at the nanoscale is required. In this work, we propose proper physico-chemical and electrical measurements. Sample preparation is also considered. Nickel and hafnium oxide are investigated. Besides the evolution of the electrical properties, we analyze the oxide modification at three levels : the chemical composition, the morphology and the electronic structure. Keywords : resistive memory, resistance switching mechanism, dielectric breakdown, NiO, HfO2, photoelectron spectroscopy, electronic transmission microscopy, atomic force microscopy, oxygen vacancies.
