The power devices are mainly based on silicon. Silicon devices have limitations in terms of operating temperature, switching frequency and breakdown voltage. An alternative can be semiconductor wide band gap devices such as 4H-SiC. Through the work of several teams of researchers around the world, the performance of the power devices in 4H-SiC improve year by year. At ampere laboratory, design, fabrication and electrical tests of 4H-SiC devices are performed. The work done in this thesis is the design, fabrication and electrical characterization of 4H-SiC power devices with a high breakdown voltage. The parameters of the edge termination are optimized using simulations based on finite elements method. The parameters of 4H-SiC during the simulation are based on previous works. Then the mask is drawn. The diodes are manufactured by IBS. First the characterization in forward and reverse mode is done before the ohmic contact annealing. The diode passivation is a single SiO2 layer. After ohmic contact annealing, the contact resistance is lower. The characterization of the breakdown voltage is performed at AMPERE and at ISL for very high voltage. Parameters such as contact resistance and carrier lifetime are estimated by fitting measured electrical characteristics with results of finite element simulation. The design of the diodes 10 kV and bipolar junction transistor 6500 V is also part of this work. This work has been performed for 2 different projects VHVD with ANR for the financial support and SiCHT2 with DGCIS for the financial support.
