Our work gives a contribution to the analysis of bonded assemblies' behaviour under high strain rates in a range from 105 s-1 to 107 s-1. We investigate the response of assemblies of aluminium 6061T6 substrates bonded with an adhesive material. The influence of the adhesive materials' nature is studied by using two kind of glue: an epoxy resin and a silicon resin. The behaviours of these materials under shock wave loading are characterized and modelling approaches are proposed. The response of bonded assemblies under shock wave loading is characterized with several experimental techniques (lasers, GEPI, gas-guns). The influence of the pulse duration on the tensile strength of the structure is investigated on a range from 3 ns to 500 ns. Laser tests help us to make microscopic observation of samples after experiments. The link between damage and rear surface velocity is established. Comparisons of measures and numerical computations with plate impact or isentropic compression experiments show that the mode of failure is mainly adhesive. Over more, the numerical computations help us to determine the tensile stress threshold with each kind of experiments and to evaluate the pulse duration influence on this threshold. These results will be used for the optimization of a shock adhesion test.
