The evolution that principally characterises the microelectronics sector is the reduction of integrated circuits dimensions. Semiconductors industry has not stopped to improve its products by increasing integration density and operation speed. However the reduced dimensions effects are not limited to a scaling factor as physical and technological limitations create new constraints. Between them, the limitations induced by the miniaturization of interconnects networks become a limiting factor for the performances of future generations integrated circuits. Signals propagation delay, power and surface consumption are the elements that drive to proposal of alternative interconnect systems above the copper and the low k materials.The feasibility of radio frequency interconnections is evaluated during this study as an alternative solution to the traditional interconnects limitations. The transmission of information via electromagnetic waves emitted and detected by integrated antennas, could solve the problem of signals propagation delay and allow to reduce the occupied surface and the consumed power.Integrated antenna performances are studied by theoretical and experimental means in the frequency range of 10 GHz to 40 GHz. Materials impact in transmitted power is analysed. Measurements realized in the prototypes of dipole antennas show an excellent transmission gain of approximately –10 dB.
