FEM simulations for built-in reliability of innovative Liquid Crystal Polymer-based QFN packaging and Sn96.5Ag3Cu0.5 solder joint
Data and Resources
Additional Info
| Field | Value |
|---|---|
| Source | Proceeding of EuroSimE 2014: IEEE International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems |
| Author | Chenniki, Walide, Bord-Majek, Isabelle, Levrier, Bruno, Wongtimnoi, Komkrisd, Diot, Jean-Luc, Ousten, Yves |
| Maintainer | CCSD |
| Last Updated | May 5, 2026, 14:38 (UTC) |
| Created | May 5, 2026, 14:38 (UTC) |
| Identifier | hal-00979149 |
| Language | en |
| contributor | Laboratoire de l'intégration, du matériau au système (IMS) ; Université de Bordeaux (UB)-Institut Polytechnique de Bordeaux-Centre National de la Recherche Scientifique (CNRS) |
| coverage | Ghent, Belgium |
| creator | Chenniki, Walide |
| date | 2014-04-07T00:00:00 |
| harvest_object_id | 47d77a02-707f-4457-92bc-526388f8a3dd |
| harvest_source_id | 3374d638-d20b-4672-ba96-a23232d55657 |
| harvest_source_title | test moissonnage SELUNE |
| metadata_modified | 2025-03-17T00:00:00 |
| set_spec | type:COMM |