Architectured materials to improve the reliability of power electronics modules : substrate and lead-free solder

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Source ISSN: 0361-5235
Author Kaabi, Abderrahmen, Bienvenu, Yves, Ryckelynck, David, Pierre, Bertrand
Maintainer CCSD
Last Updated May 6, 2026, 03:24 (UTC)
Created May 6, 2026, 03:24 (UTC)
Identifier hal-00955777
Language en
contributor Centre des Matériaux (MAT) ; Mines Paris - PSL (École nationale supérieure des mines de Paris) ; Université Paris Sciences et Lettres (PSL)-Université Paris Sciences et Lettres (PSL)-Centre National de la Recherche Scientifique (CNRS)
creator Kaabi, Abderrahmen
date 2014-05-06T00:00:00
harvest_object_id 95ca91ef-d6cb-403c-91f4-939233141bf0
harvest_source_id 3374d638-d20b-4672-ba96-a23232d55657
harvest_source_title test moissonnage SELUNE
metadata_modified 2025-12-01T00:00:00
relation info:eu-repo/semantics/altIdentifier/doi/10.1007/s11664-013-2662-4
set_spec type:ART