Impact of Thermal Aging on the Microstructure Evolution and Mechanical Properties of Lanthanum-Doped Tin-Silver-Copper Lead-Free Solders

The authors would like to thank Ste'phanie Blanc (Electrical Engineer at Schlumberger) for her useful contribution to the project, Claude Guyomard and Olivier Naegelen (Arts et Me'tiers ParisTech) for the die design and sample casting, respectively, and Jean-Marc Raulot for his enriching discussions.

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Source ISSN: 0361-5235
Author Sadiq, Muhammad, Pesci, Raphaël, Cherkaoui, Mohammed
Maintainer CCSD
Last Updated May 7, 2026, 07:23 (UTC)
Created May 7, 2026, 07:23 (UTC)
Identifier hal-00934931
Language en
Rights https://about.hal.science/hal-authorisation-v1/
contributor Georgia Tech Lorraine [Metz] ; Georgia Institute of Technology [Atlanta]-Ecole Supérieure d'Electricité - SUPELEC (FRANCE)-CentraleSupélec-Centre National de la Recherche Scientifique (CNRS)-Université de Franche-Comté (UFC) ; Université Bourgogne Franche-Comté [COMUE] (UBFC)-Université Bourgogne Franche-Comté [COMUE] (UBFC)-Arts et Métiers Sciences et Technologies
creator Sadiq, Muhammad
date 2013-05-07T00:00:00
harvest_object_id 8ea0efc3-2af3-4838-9eec-6db356c51f9f
harvest_source_id 3374d638-d20b-4672-ba96-a23232d55657
harvest_source_title test moissonnage SELUNE
metadata_modified 2026-04-13T00:00:00
relation info:eu-repo/semantics/altIdentifier/doi/10.1007/s11664-012-2351-8
set_spec type:ART