Improving the Performance of CNT to CNT Bumps for Flip Chip Applications
Data and Resources
Additional Info
| Field | Value |
|---|---|
| Source | International Conference on Material for Advanced Technologies, ICMAT 2013 |
| Author | Baillargeat, Dominique, Chong Yap, Chin, Tan, Dunlin, Brun, Christophe, Wei, Jun, Hang Tong Teo, Edwin, Kang Tay, Beng |
| Maintainer | CCSD |
| Last Updated | May 7, 2026, 16:47 (UTC) |
| Created | May 7, 2026, 16:47 (UTC) |
| Identifier | hal-00922471 |
| Language | en |
| contributor | MINACOM (XLIM-MINACOM) ; XLIM (XLIM) ; Université de Limoges (UNILIM)-Centre National de la Recherche Scientifique (CNRS)-Université de Limoges (UNILIM)-Centre National de la Recherche Scientifique (CNRS) |
| creator | Baillargeat, Dominique |
| date | 2013-06-30T00:00:00 |
| harvest_object_id | d81524a4-cbbd-4928-9d37-e20407d2dcf6 |
| harvest_source_id | 3374d638-d20b-4672-ba96-a23232d55657 |
| harvest_source_title | test moissonnage SELUNE |
| metadata_modified | 2026-01-29T00:00:00 |
| set_spec | type:COMM |