Two analytical models for thermal constriction resistance prediction at solideliquid interface have been compared in this study. The wettability parameters (surface tensions and contact angle) have been taken into account in the models. These models have been used in conjunction with a thermal nterstitial resistance to improve the prediction of the bulk thermal contact resistance (TCR) at the solid/liquid interface. A relatively good agreement etween the predictions and the experimental data has been obtained and the capability of the models to predict the TCR is shown. Therefore, the models have been used to investigate the effect of the contact temperature on the onstriction and interstitial resistance. The evolution of the equivalent ntrapped air layer thickness with the temperature has been estimated. The results have shown that the TCR and the equivalent air layer thickness ecrease when contact temperature increases.
