Investigations of thermal interfaces aging under thermal cycling conditions for power electronics applications

This paper presents new investigations on the aging of Thermal Interface Materials (TIMs) subjected to thermal cycling conditions. The challenge was to design a specific and original set-up in order to not only undergo avionic temperature mission profile (50 C/+150 C) but also to perform standardized thermal characterization at always same conditions. Thermal conductivity is used as aging indicator. Several TIM materials (change phase, graphite and polymer based) have undergone more than 1500 of such cycles. As a result, only the phase change material thermal interface has been affected with a 30% increase of initial thermal resistance.

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Source ISSN: 0026-2714
Author Ousten, Jean Pierre, Khatir, Zoubir
Maintainer CCSD
Last Updated May 9, 2026, 05:11 (UTC)
Created May 9, 2026, 05:11 (UTC)
Identifier hal-00878177
Language en
contributor Laboratoire des Technologies Nouvelles (IFSTTAR/LTN) ; Institut Français des Sciences et Technologies des Transports, de l'Aménagement et des Réseaux (IFSTTAR)
creator Ousten, Jean Pierre
date 2011-01-01T00:00:00
harvest_object_id 32c7453e-7114-45fe-a705-a052e1fd7717
harvest_source_id 3374d638-d20b-4672-ba96-a23232d55657
harvest_source_title test moissonnage SELUNE
metadata_modified 2023-08-07T00:00:00
relation info:eu-repo/semantics/altIdentifier/doi/10.1016/j.microrel.2011.07.066
set_spec type:ART