Stress-induced lift-off method for kerf-loss-free wafering of ultra-thin (∼50 μm) crystalline Si wafers
Data and Resources
Additional Info
| Field | Value |
|---|---|
| Source | Conference Record of the IEEE Photovoltaic Specialists Conference |
| Author | Dross, Frédéric, Milhe, Aurélien, Robbelein, Jo, Gordon, Ivan, Bouchard, Pierre-Olivier, Beaucarne, Guy, Poortmans, Jef |
| Maintainer | CCSD |
| Last Updated | May 10, 2026, 06:45 (UTC) |
| Created | May 10, 2026, 06:45 (UTC) |
| Identifier | hal-00846861 |
| Language | en |
| contributor | Interuniversity Microelectronics Centre (imec) |
| coverage | San Diego, United States |
| creator | Dross, Frédéric |
| date | 2008-05-11T00:00:00 |
| harvest_object_id | 84229a49-2864-40a7-b528-e947724f4c9e |
| harvest_source_id | 3374d638-d20b-4672-ba96-a23232d55657 |
| harvest_source_title | test moissonnage SELUNE |
| metadata_modified | 2026-04-20T00:00:00 |
| relation | info:eu-repo/semantics/altIdentifier/doi/10.1109/PVSC.2008.4922741 |
| set_spec | type:COMM |