Prediction of thermo-mechanical fatigue for solder joints in power electronics modules under passive temperature cycling
Data and Resources
Additional Info
| Field | Value |
|---|---|
| Source | ISSN: 0013-7944 |
| Author | Benabou, L., Sun, Zhidan, Dahoo, Pierre Richard |
| Maintainer | CCSD |
| Last Updated | May 10, 2026, 20:37 (UTC) |
| Created | May 10, 2026, 20:37 (UTC) |
| Identifier | hal-00830637 |
| Language | en |
| contributor | Laboratoire d'Ingénierie des Systèmes de Versailles (LISV) ; Université de Versailles Saint-Quentin-en-Yvelines (UVSQ) |
| creator | Benabou, L. |
| date | 2013-05-10T00:00:00 |
| harvest_object_id | aa3f0096-74cd-4b06-8db4-9b06bc67e684 |
| harvest_source_id | 3374d638-d20b-4672-ba96-a23232d55657 |
| harvest_source_title | test moissonnage SELUNE |
| metadata_modified | 2025-12-20T00:00:00 |
| relation | info:eu-repo/semantics/altIdentifier/doi/10.1016/j.engfracmech.2013.05.009 |
| set_spec | type:ART |