Copper particles/epoxy resin thermosetting conductive adhesive using polyamide resin as curing agent
Data and Resources
Additional Info
| Field | Value |
|---|---|
| Source | ISSN: 0021-8995 |
| Author | Dang, Zhi-Min, Zhang,, Bo, Li, Jinge, Zha, Jun-Wei, Hu, Guo-Hua |
| Maintainer | CCSD |
| Last Updated | May 15, 2026, 04:01 (UTC) |
| Created | May 15, 2026, 04:01 (UTC) |
| Identifier | hal-00778384 |
| Language | en |
| contributor | Sch Chem & Biol Engn, Dept Polymer Sci & Engn, ; University of Science and Technology Beijing [Beijing] (USTB) |
| creator | Dang, Zhi-Min |
| date | 2012-11-05T00:00:00 |
| harvest_object_id | bfd97a28-57b8-434f-abb5-2d4cf3d0e201 |
| harvest_source_id | 3374d638-d20b-4672-ba96-a23232d55657 |
| harvest_source_title | test moissonnage SELUNE |
| metadata_modified | 2024-10-29T00:00:00 |
| relation | info:eu-repo/semantics/altIdentifier/doi/10.1002/app.36951 |
| set_spec | type:ART |