Electromigration degradation mechanism analysis of SnAgCu interconnects for eWLB package
Data and Resources
Additional Info
| Field | Value |
|---|---|
| Source | Proc. of IEEE International Reliability Physics Symposium (IRPS'12) |
| Author | Frank, T., Chappaz, C., Arnaud, L., Federspiel, X., Colella, F., Petitprez, E., Anghel, Lorena |
| Maintainer | CCSD |
| Last Updated | October 30, 2026, 05:29 (UTC) |
| Created | October 30, 2026, 05:29 (UTC) |
| Identifier | hal-00747359 |
| Language | en |
| contributor | STMicroelectronics [Crolles] (ST-CROLLES) |
| coverage | Anaheim, CA, United States |
| creator | Frank, T. |
| date | 2012-04-15T00:00:00 |
| harvest_object_id | ef7df3f0-91c8-40c7-b0c2-28322a2eced3 |
| harvest_source_id | 3374d638-d20b-4672-ba96-a23232d55657 |
| harvest_source_title | test moissonnage SELUNE |
| metadata_modified | 2026-03-26T00:00:00 |
| relation | info:eu-repo/semantics/altIdentifier/doi/10.1109/IRPS.2012.6241792 |
| set_spec | type:COMM |