Sintered molybdenum for a metallized ceramic substrate packaging for the wide-bandgap devices and high temperature applications

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Source Proceedings of the 2012 24th IEEE International Symposium on Power Semiconductor Devices and ICs
Author Mouawad, Bassem, Buttay, Cyril, Soueidan, Maher, Morel, Hervé, Bley, Vincent, Fabregue, D., Mercier, Florian
Maintainer CCSD
Last Updated May 15, 2026, 18:41 (UTC)
Created May 15, 2026, 18:41 (UTC)
Identifier hal-00707820
Language en
Rights https://about.hal.science/hal-authorisation-v1/
contributor Ampère (AMPERE) ; École Centrale de Lyon (ECL) ; Université de Lyon-Université de Lyon-Université Claude Bernard Lyon 1 (UCBL) ; Université de Lyon-Institut National des Sciences Appliquées de Lyon (INSA Lyon) ; Université de Lyon-Institut National des Sciences Appliquées (INSA)-Institut National des Sciences Appliquées (INSA)-Centre National de la Recherche Scientifique (CNRS)-Institut National de Recherche pour l’Agriculture, l’Alimentation et l’Environnement (INRAE)
coverage Bruges, Belgium
creator Mouawad, Bassem
date 2012-06-03T00:00:00
harvest_object_id 2aef0b8d-a910-42b5-80ed-2b0b8c706de1
harvest_source_id 3374d638-d20b-4672-ba96-a23232d55657
harvest_source_title test moissonnage SELUNE
metadata_modified 2026-03-10T00:00:00
relation info:eu-repo/semantics/altIdentifier/doi/10.1109/ISPSD.2012.6229081
set_spec type:COMM