Adhesion mechanism of copper films deposited by magnetron sputtering on polyamide composites
Data and Resources
Additional Info
| Field | Value |
|---|---|
| Source | ISSN: 0267-0844 |
| Author | Legois, Y., Aucouturier, Marc, Ollivier, E., Darque-Ceretti, Evelyne, Macheto, P. |
| Maintainer | CCSD |
| Last Updated | May 27, 2026, 01:21 (UTC) |
| Created | May 27, 2026, 01:21 (UTC) |
| Identifier | hal-00674005 |
| Language | en |
| contributor | Laboratoire de Métallurgie ; Université Paris-Sud - Paris 11 (UP11) |
| creator | Legois, Y. |
| date | 1998-05-27T00:00:00 |
| harvest_object_id | ec7ca788-e06b-454b-8be2-378cd4ce97d5 |
| harvest_source_id | 3374d638-d20b-4672-ba96-a23232d55657 |
| harvest_source_title | test moissonnage SELUNE |
| metadata_modified | 2024-08-27T00:00:00 |
| set_spec | type:ART |