Die Attach of Power Devices Using Silver Sintering - Bonding Process Optimization and Characterization
Data and Resources
Additional Info
| Field | Value |
|---|---|
| Source | Proceedings of the High Temperature Electronics Network conference |
| Author | Buttay, Cyril, Masson, Amandine, Li, Jianfeng, Johnson, Mark, C., Lazar, Mihai, Raynaud, Christophe, Morel, Hervé |
| Maintainer | CCSD |
| Last Updated | May 27, 2026, 16:56 (UTC) |
| Created | May 27, 2026, 16:56 (UTC) |
| Identifier | hal-00672619 |
| Language | en |
| Rights | https://about.hal.science/hal-authorisation-v1/ |
| contributor | Ampère (AMPERE) ; École Centrale de Lyon (ECL) ; Université de Lyon-Université de Lyon-Université Claude Bernard Lyon 1 (UCBL) ; Université de Lyon-Institut National des Sciences Appliquées de Lyon (INSA Lyon) ; Université de Lyon-Institut National des Sciences Appliquées (INSA)-Institut National des Sciences Appliquées (INSA)-Centre National de la Recherche Scientifique (CNRS)-Institut National de Recherche pour l’Agriculture, l’Alimentation et l’Environnement (INRAE) |
| coverage | Oxford, United Kingdom |
| creator | Buttay, Cyril |
| date | 2011-07-18T00:00:00 |
| harvest_object_id | 7ed18c28-2a69-44ce-ab78-de52229be229 |
| harvest_source_id | 3374d638-d20b-4672-ba96-a23232d55657 |
| harvest_source_title | test moissonnage SELUNE |
| metadata_modified | 2026-03-10T00:00:00 |
| set_spec | type:COMM |