A 75 ps rms time resolution BiCMOS time to digital converter optimized for high rate imaging detectors

This paper presents an integrated time to digital converter (TDC) with a bin size adjustable in the range of 125 to 175 ps and a differential nonlinearity of 0.3%. The TDC has four channels. Its architecture has been optimized for the readout of imaging detectors in use at Synchrotron Radiation facilities. In particular, a built-in logic flags piled-up events. Multi-hit patterns are also supported for other applications. Time measurements are extracted off chip at the maximum throughput of 40 MHz. The dynamic range is 14 bits. It has been fabricated in 0.8 mu m BiCMOS technology. Time critical inputs are PECL compatible whereas other signals are CMOS compatible. A second application specific integrated circuit (ASIC) has been developed which translates NIM electrical levels to PECL ones. Both circuits are used to assemble board level TDCs complying with industry standards like VME, NIM and PCI

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Source ISSN: 0168-9002
Author Herve, C., Torki, K.
Maintainer CCSD
Last Updated May 11, 2026, 10:34 (UTC)
Created May 11, 2026, 10:34 (UTC)
Identifier hal-00081495
Language en
contributor European Synchrotron Radiation Facility (ESRF)
creator Herve, C.
date 2002-05-11T00:00:00
harvest_object_id 847e746e-6a1f-4091-91e4-abd28ad7d4f0
harvest_source_id 3374d638-d20b-4672-ba96-a23232d55657
harvest_source_title test moissonnage SELUNE
metadata_modified 2026-03-26T00:00:00
set_spec type:ART