Thermal modelling of multiple die packages
Data and Resources
Additional Info
| Field | Value |
|---|---|
| Source | Electronic Packaging Technology Conference, 2005. EPTC 2005. Proceedings of 7th |
| Author | Szabo, P., Rencz, M., Szekely, V., Poppe, A., Farkas, G., Courtois, B. |
| Maintainer | CCSD |
| Last Updated | May 14, 2026, 06:42 (UTC) |
| Created | May 14, 2026, 06:42 (UTC) |
| Identifier | hal-00079216 |
| Language | en |
| contributor | MicRed Microelectronics ; Res & Dev Ltd. |
| coverage | Singapore, Singapore |
| creator | Szabo, P. |
| date | 2005-05-14T00:00:00 |
| harvest_object_id | 2193de9c-462d-42e4-913d-378737146f58 |
| harvest_source_id | 3374d638-d20b-4672-ba96-a23232d55657 |
| harvest_source_title | test moissonnage SELUNE |
| metadata_modified | 2026-03-26T00:00:00 |
| relation | info:eu-repo/semantics/altIdentifier/doi/10.1109/EPTC.2005.1614459 |
| set_spec | type:COMM |