Chip integration using inkjet-printed silver conductive tracks reinforced by electroless plating for flexible board packages
Data and Resources
Additional Info
| Field | Value |
|---|---|
| Source | IMAPS Proceedings |
| Author | Cauchois, Romain, Saadaoui, Mohamed, Legeleux, Jacques, Malia, Thierry, Dubois-Bonvalot, Béatrice, Inal, Karim, Fidalgo, Jean-Christophe |
| Maintainer | CCSD |
| Last Updated | May 20, 2026, 15:55 (UTC) |
| Created | May 20, 2026, 15:55 (UTC) |
| Identifier | emse-00691806 |
| Language | en |
| Rights | https://about.hal.science/hal-authorisation-v1/ |
| contributor | Innovation and Manufacturing Technologies (IMT) ; GEMALTO (GEMALTO) |
| coverage | Grenoble, France |
| creator | Cauchois, Romain |
| date | 2012-04-25T00:00:00 |
| harvest_object_id | 0f4bb5e0-1a80-44dc-bd84-cbeeb16a87e0 |
| harvest_source_id | 3374d638-d20b-4672-ba96-a23232d55657 |
| harvest_source_title | test moissonnage SELUNE |
| metadata_modified | 2026-01-19T00:00:00 |
| set_spec | type:COMM |