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Post Etch Plasma Treatments used for Porous SiOCH Materials Integration for I...
The decrease of the integrated circuits size lets to increase the performances and reduce the manufacture costs. However, this shrink causes the preponderance of... -
DLC films on LiTaO3 for SAW devices
In this work, we study the modification of the piezoelectric surface after immersion in a methane plasma, the adhesion of DLC films without a buffer layer and the...
