-
Post Etch Plasma Treatments used for Porous SiOCH Materials Integration for I...
The decrease of the integrated circuits size lets to increase the performances and reduce the manufacture costs. However, this shrink causes the preponderance of... -
Experimental and numerical study of the micro-spalling of metallic targets su...
Micro-spalling is a failure phenomenon consisting in dynamic fragmentation of a material after partial or full melting under intense shock wave loading. High power... -
Archéologie et Histoire des techniques.
International audience -
Thin film deposition of pure and doped TiO2 by RF magnetron sputtering for vi...
Three different ways to dope nitrogen into TiO2 by means of RF reactive sputtering was compared, and the structural, optical, and photo-active performance of these... -
Investigation of Fragments Size Resulting from Dynamic Fragmentation in Melte...
International audience -
Hyperfine interactions, charge compensation mechanisms, and the distribution ...
International audience -
Refinement of precipitate distributions in an age-hardenable Mg-Sn alloy thro...
It has been known for some time that trace additions ( 2 Sn phase formed, although a substantial refinement of the distributions is observed. In the case of Na... -
Enhancement of near-band edge photoluminescence of ZnO film buffered with TiN
International audience -
Multi-shape Tasks Scheduling for Online Multitasking on FPGAs
International audience
