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Post Etch Plasma Treatments used for Porous SiOCH Materials Integration for I...
The decrease of the integrated circuits size lets to increase the performances and reduce the manufacture costs. However, this shrink causes the preponderance of... -
Development of copper electroplating processes for Through Silicon Via (TSV) ...
Nowadays, 2D integration shows serious limitations when it comes to manufacturing devices with increased functionality and performance. In this context, 3D integration... -
Carbon nanotube bumps for the flip chip packaging system
International audience -
Modeling and simulation of interconnects within and between electronic systems
The ongoing progress in transistor miniaturization and a continuous frequency increase are the main trends in the present day evolution of electronic circuits. A...
