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Three dimensional Stacking of Integrated circuits
During 50 years, semiconductor technology has been evolving in exponential rates in both productivity and performance. By following a steady technological path that... -
Innovative power electronics assemblies using the "Spark Plasma Sintering" te...
The increase in operating temperature is one of the current trends in power electronics. This operation leads firstly to changes in the structure of power modules such... -
Investigation of the mechanisms involved in room temperature metal and oxides...
Direct wafer bonding refers to a process by which two mirror-polished wafers are put into contact and held together at room temperature without any additional...
