Etude prédictive de fiabilité de nouveaux concepts d'assemblage pour des " system-in-package " hétérogènes
type: Dataset
description: This thesis project is a study of the predictive reliability of new microelectronic package concepts such as "system in package" SiP. The objective is to develop a reliable predictive methodology adapted to the new assembly concepts to optimize and to predict the performance at the design phase. Then, the methodology is applied to concrete projects. This methodology of predictive reliability involves the use of experimental studies, thermomechanical simulations and statistical analysis to process the data and assess the reliability and risks of failure. The use of simulation tools for electronic components is well suited to assist in the evaluation of the most fragile areas, the setting up of design rules and the determination of the most influential parameters with a reduction in the setup time market for a reliable and optimized performance. Studies on silicon strength are conducted with two tests: ball on ring test and on three-point bend test show that the grinding and the thickness influence the variation of the stress and deflection of the silicon at break. With the three points bend test, the onset of crack is linked to defects in sawing and grinding zone. However, with the ball on ring test, only the surface quality influences the initiation of cracks. The ball on ring test is well suited for evaluating the quality of the silicon surface. Chemical techniques of stress release, such as wet etching and plasma etching, improve significantly the strength of silicon samples. These tests on silicon dies are used to characterize the breakdown of silicon under bending test and to complete the simulation results. We have demonstrated in this work, the need and the usefulness of the virtual prototyping of electronic components and the use of a predictive methodology in assessing reliability.
issued: 2026-05-05T11:17:44.184157
language: fr
modified: 2026-05-05T11:17:44.184161
contact point: Organization
  fn: CCSD
keyword: assemblages-technologie----fiabilite
keyword: boitier-electronique
keyword: infoeu-reposemanticsdoctoralthesis
keyword: methodologie-de-fiabilite-predictive
keyword: microassemblages
keyword: microelectronique
keyword: plans-dexperience
keyword: prototypage-virtuel
keyword: resistance-mecanique-du-silicium
keyword: simulation-thermomecanique
keyword: spitronengineering-sciences-physicselectronics
keyword: test-bille-sur-anneau
keyword: test-trois-points
keyword: theses
landing page: https://theses.hal.science/tel-00990889

Etude prédictive de fiabilité de nouveaux concepts d'assemblage pour des " system-in-package " hétérogènes
type: Distribution
format: HTML
issued: 2026-05-05T11:17:44.186252
modified: 2026-05-05T11:17:44.164459
access URL: https://theses.hal.science/tel-00990889

test_moissonnage_selune
type: Agent