Contribution à l'étude, la mise en œuvre et à l'évaluation d'une solution de report de puce de puissance par procédé de frittage de pâte d'argent à haute pression et basse température
type: Dataset
contact point: Organization
  fn: CCSD
keyword: techniques-dassemblages-sans-plomb
keyword: assemblages-de-puissance
keyword: spitronengineering-sciences-physicselectronics
keyword: packaging
keyword: evaluation-de-la-duree-de-vie
keyword: frittage-de-pate-dargent
keyword: theses
keyword: modelisations-par-elements-finis
keyword: infoeu-reposemanticsdoctoralthesis
keyword: rohs
keyword: fiabilite
landing page: https://theses.hal.science/tel-00988784
description: This work is part of the research for lead-free die-attach solutions for power modules to offer a solution to the European directive RoHS, which banishes lead in electrical and electronic equipments. The intrinsic silver properties and the previous work published helped us choose silver sintering as the die-attach technology to be tested and evaluated in our work. After a state of the art on power module structure, on different die-attach technologies and on power module reliability, various works have been carried out in collaboration with the FIDEA and ASPEEC projects. Through experimental tests and finite element modeling analysis (FEM), die-attach processes have been defined, thermal and mechanical characterizations and reliability assessment of silver sintered power modules have been done. Finally, a silver sintered rectifier bridge double side assembly with higher thermomechanical properties than a lead-solder die-attach assembly was developed as final prototype.
issued: 2026-05-05T11:46:07.888849
language: fr
modified: 2026-05-05T11:46:07.888853

test_moissonnage_selune
type: Agent

Contribution à l'étude, la mise en œuvre et à l'évaluation d'une solution de report de puce de puissance par procédé de frittage de pâte d'argent à haute pression et basse température
type: Distribution
access URL: https://theses.hal.science/tel-00988784
format: HTML
issued: 2026-05-05T11:46:07.890801
modified: 2026-05-05T11:46:07.866652