Innovative power electronics assemblies using the "Spark Plasma Sintering" technique
type: Dataset
description: The increase in operating temperature is one of the current trends in power electronics. This operation leads firstly to changes in the structure of power modules such as "3D" structures to provide a double-side cooling of power components, and secondly the use of materials that reduce thermomechanical stresses, related to the difference in coefficient of thermal expansion. The study realized during this thesis consisted in developing a new "3D" structure based on copper microposts prepared by electroplating, which are then assembled to a metallized ceramic substrate (eg, a DBC: Direct Bonding Copper). To realize this contact, a sintering machine (SPS: Spark Plasma Sintering) is used first to study the direct bonding of copper on solid, and second to perform the bonding between the copper microposts and the DBC. This technique is also used for the production of a new metallized ceramic substrate using materials with matching thermal expansion coefficients, for high temperature applications.
identifier: NNT: 2013ISAL0017
issued: 2026-05-07T02:03:36.028653
language: fr
modified: 2026-05-07T02:03:36.028660
contact point: Organization
  fn: CCSD
keyword: 3d-interconnection
keyword: collage-direct-de-cuivre
keyword: composant-de-puissance
keyword: composant-de-puissance-integre
keyword: controle-de-la-temperature
keyword: direct-bonding
keyword: electrodeposition
keyword: electronique-de-puissance
keyword: electroplating
keyword: frittage
keyword: infoeu-reposemanticsdoctoralthesis
keyword: integrated-power-component
keyword: interconnexion-3d
keyword: interconnexion-en-cuivre
keyword: metallized-ceramic-substrat
keyword: packaging
keyword: power-component
keyword: power-electronics
keyword: sintering
keyword: spark-plasma-sintering
keyword: spiotherengineering-sciences-physicsother
keyword: substrat-ceramique-metallise
keyword: theses
landing page: https://theses.hal.science/tel-00943438

Innovative power electronics assemblies using the "Spark Plasma Sintering" technique
type: Distribution
format: HTML
issued: 2026-05-07T02:03:36.054118
modified: 2026-05-07T02:03:36.007264
access URL: https://theses.hal.science/tel-00943438

test_moissonnage_selune
type: Agent