test_moissonnage_selune
type: Agent

Microstructuring inkjet-printed deposits from silver nanoparticules coalescence to the fabrication of interconnections for electronic devices.
type: Dataset
contact point: Organization
  fn: CCSD
keyword: jet-dencre
keyword: electronique-imprimee
keyword: interconnect
keyword: interconnexion
keyword: coalescence
keyword: resistivite
keyword: inkjet-printing
keyword: nanoparticule
keyword: resistivity
keyword: selective-sintering
keyword: recuit-selectif
keyword: theses
keyword: spiotherengineering-sciences-physicsother
keyword: printed-electronics
keyword: infoeu-reposemanticsdoctoralthesis
keyword: nanoparticle
keyword: microstructure
landing page: https://theses.hal.science/tel-00847021
description: Several challenges are still holding back the technological transfer of printed electronics to industry in spite of recent progresses. In this thesis work, the printing method of inks based on silver nanoparticles (<Ø>=25 nm) was optimized according to its rheology and to the fluid/substrate interactions for the fabrication of electrical interconnections with a thickness of 500 nm. These lines were printed on silicon or flexible substrates and annealed either by conventional (oven or infrared) or selective methods (microwave) at temperatures comprised between 100 and 300 °C.A better understanding of the relationship between process and microstructure of these printed thin films, based on several crystallographic equipments (XRD, EBSD and EDX), led to the optimization of nanocrystallites growth with an activation energy of about 3 to 5 kJ•mol-1. In addition to the low residual stress (70 MPa), this optimization is used to achieve low electrical resistivity (3.4 μOhm•cm) associated with a greater coherence of the crystal lattices at grain boundaries. The probability of electron scattering at such interfaces can be further reduced using an innovative approach of oriented crystallite growth by atomic interdiffusion from the substrate.The low mechanical stiffness (E<50 GPa) of these porous lines requires a reinforcement step either by crystalline texturation or by electroless growth to withstand the assembly and wire-bonding steps. The fabrication of a functional demonstrator thus validated the printing technology for the manufacture of electronic components.
identifier: NNT: 2012EMSE0643
issued: 2026-05-10T06:34:42.690037
language: en
modified: 2026-05-10T06:34:42.690041

Microstructuring inkjet-printed deposits from silver nanoparticules coalescence to the fabrication of interconnections for electronic devices.
type: Distribution
access URL: https://theses.hal.science/tel-00847021
format: HTML
issued: 2026-05-10T06:34:42.692008
modified: 2026-05-10T06:34:42.672323