Modeling, characterization and analysis of integrated PLL systems using a global chip-package-board approach
type: Dataset
description: This thesis work focuses on characterization, modeling and analysis of «Pulling» and «Pushing» phenomena in Phase Locked Loops (PLL) based on a global approach where distributed effects of electromagnetic couplings at different integration levels (chip-level, assembly-level, board or PCB-level) are taken into account. The modeling approach adopts a hybrid methodology where the analysis of electromagnetic couplings combined with broadband equivalent circuit synthesis (compatible with library models of active components) is coupled with dynamic behavioral representations. The derived behavioral representations properly capture the effects of nonlinearities both at component scale (non-linear characteristic of varicap as function of control voltages) and at function block level (non-uniform gain KVCO of VCO circuits depending on frequency).The hybrid methodology renders possible the assessment of competitive effects resulting from «Pulling» and «Pushing» phenomena at chip level (influence of the PLL, effects of the power amplifier, power integrity, or ground reference distribution, etc..), and the distortions induced by components external to the chip at package and board levels (such as components on PCB: SAW filters, decoupling capacitors, matching networks).The proposed approach is used for the study and design of two types of circuits developed by NXP- Semiconductors, for applications related to automotive security and immobilization (an RF low power transceiver Integrated Circuit (PLL running around 1.763GHz), and to satellite receiver (PLL operating at low power for LNB circuits working at 9.75/10.6 GHz).The obtained modeling results are validated by correlation with experimental data and by comparison with different time-domain and frequency-domain simulation tools results (ADS-Harmonic Balance, ADS-Shooting solutions, Cadence-Spectre)
identifier: NNT: 2011PEST1045
issued: 2026-05-15T00:45:13.597761
language: fr
modified: 2026-05-15T00:45:13.597772
contact point: Organization
  fn: CCSD
keyword: behavioral-modeling
keyword: chip-package-board-co-simulation
keyword: co-simulation-puce-boitier-circuit-imprime
keyword: couplages-electromagnetique
keyword: effets-de-pulling-et-de-pushing
keyword: electromagnetic-couplings
keyword: hybrid-methodologies
keyword: infoeu-reposemanticsdoctoralthesis
keyword: methodologies-hybrides
keyword: modelisation-comportementale
keyword: pll
keyword: pulling-and-pushing-effects
keyword: spiotherengineering-sciences-physicsother
keyword: theses
landing page: https://theses.hal.science/tel-00779319

Modeling, characterization and analysis of integrated PLL systems using a global chip-package-board approach
type: Distribution
format: HTML
issued: 2026-05-15T00:45:13.609008
modified: 2026-05-15T00:45:13.535749
access URL: https://theses.hal.science/tel-00779319

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type: Agent