Study of hybridization mechanisms for two dimensional infrared detectors
type: Dataset
description: Evolution of microelectronics follows several major roads, in particular the size decrease of active elements (reduction of size of transistors), better electrical performances, high I/O density and smaller size. This revolution has been predicted by Gordon Moore who suggested that integrated circuits would double in complexity every 24 months. As a consequence, this evolution induces both the reduction of prices and the weight of components.The term flip chip describes the method of electrically connecting the die to the package substrate. Flip chip microelectronic assembly is the direct electrical connection of face-down (or flipped) integrated circuit (IC) chips onto substrates, circuit boards, or carriers, using conductive bumps on the chip bond pads. Flip chip offers the highest speed electrical performance, reduces the delaying inductance and capacitance of the connection, Smallest Size Greatest I/O Flexibility, Most Rugged, high I/O density and Lowest Cost.This thesis work study concentrates on two main directions. The first one concerns hybridization by means of the technology of Indium bumps associated to a reflow process and the second one is about pressure induced hybridization at low temperature using nanostructures (Nano-scratch). In this work, we have developed a complete process to assemble a focal plane array format of 640 x 512 pixels with a pitch of 15 µm. These studies also allowed the mechanical validation of hybridization of a focal plane arrays 1280*1024 pixels with a pitch of 10 µm. Concerning alternative technologies to flip chip reflow, we introduced and demonstrate the relevance of a method of growth of ZnO nanorods using low temperature wet chemical growth and further hybridization at ambient temperature.
identifier: NNT: 2012PA112342
issued: 2026-05-15T09:44:55.981007
language: fr
modified: 2026-05-15T09:44:55.981013
contact point: Organization
  fn: CCSD
keyword: active-elements
keyword: bille-indium
keyword: bumps-indium
keyword: elements-actifs
keyword: flip-chip
keyword: hybridation
keyword: hybridization
keyword: infoeu-reposemanticsdoctoralthesis
keyword: io-density
keyword: miniaturisation
keyword: nano-fils
keyword: nano-scratch
keyword: nanorod
keyword: smallest
keyword: spiotherengineering-sciences-physicsother
keyword: theses
landing page: https://theses.hal.science/tel-00773021

Study of hybridization mechanisms for two dimensional infrared detectors
type: Distribution
format: HTML
issued: 2026-05-15T09:44:56.076530
modified: 2026-05-15T09:44:55.947230
access URL: https://theses.hal.science/tel-00773021

test_moissonnage_selune
type: Agent