@prefix dcat: <http://www.w3.org/ns/dcat#> .
@prefix dct: <http://purl.org/dc/terms/> .
@prefix foaf: <http://xmlns.com/foaf/0.1/> .
@prefix vcard: <http://www.w3.org/2006/vcard/ns#> .
@prefix xsd: <http://www.w3.org/2001/XMLSchema#> .

<https://rec.harvest-normandie.data4citizen.com/dataset/oai-hal-hal-00979149v1> a dcat:Dataset ;
    dct:description "International audience" ;
    dct:identifier "hal-00979149" ;
    dct:issued "2026-05-05T14:38:38.578722"^^xsd:dateTime ;
    dct:language "en" ;
    dct:modified "2026-05-05T14:38:38.578728"^^xsd:dateTime ;
    dct:publisher <https://rec.harvest-normandie.data4citizen.com/organization/cce9db95-46d9-4dc2-84b6-764215d0a002> ;
    dct:title "FEM simulations for built-in reliability of innovative Liquid Crystal Polymer-based QFN packaging and Sn96.5Ag3Cu0.5 solder joint" ;
    dcat:contactPoint [ a vcard:Organization ;
            vcard:fn "CCSD" ] ;
    dcat:distribution <https://rec.harvest-normandie.data4citizen.com/dataset/oai-hal-hal-00979149v1/resource/f68fb2d4-e3ee-482d-862e-c8d6e1e1b4a4> ;
    dcat:keyword "conference-papers",
        "infoeu-reposemanticsconferenceobject",
        "spitronengineering-sciences-physicselectronics" ;
    dcat:landingPage <Proceeding%20of%20EuroSimE%202014:%20IEEE%20International%20Conference%20on%20Thermal%2C%20Mechanical%20and%20Multi-Physics%20Simulation%20and%20Experiments%20in%20Microelectronics%20and%20Microsystems> .

<Proceeding%20of%20EuroSimE%202014:%20IEEE%20International%20Conference%20on%20Thermal%2C%20Mechanical%20and%20Multi-Physics%20Simulation%20and%20Experiments%20in%20Microelectronics%20and%20Microsystems> a foaf:Document .

<https://rec.harvest-normandie.data4citizen.com/dataset/oai-hal-hal-00979149v1/resource/f68fb2d4-e3ee-482d-862e-c8d6e1e1b4a4> a dcat:Distribution ;
    dct:format "HTML" ;
    dct:issued "2026-05-05T14:38:38.580029"^^xsd:dateTime ;
    dct:modified "2026-05-05T14:38:38.573330"^^xsd:dateTime ;
    dct:title "FEM simulations for built-in reliability of innovative Liquid Crystal Polymer-based QFN packaging and Sn96.5Ag3Cu0.5 solder joint" ;
    dcat:accessURL <https://hal.science/hal-00979149> .

<https://rec.harvest-normandie.data4citizen.com/organization/cce9db95-46d9-4dc2-84b6-764215d0a002> a foaf:Agent ;
    foaf:name "test_moissonnage_selune" .