Mechanical stress induced by electromagnetic forces on wire bonds of high power modules
type: Dataset
description: International audience
issued: 2026-05-05T16:04:25.932921
language: en
modified: 2026-05-05T16:04:25.932925
contact point: Organization
  fn: CCSD
keyword: conference-papers
keyword: electromagnetic-forces
keyword: infoeu-reposemanticsconferenceobject
keyword: mechanical-stress
keyword: spielecengineering-sciences-physicselectromagnetism
keyword: wire-bonding
landing page: Proceesdings of EuroEm 2012 (European Electromagnetics)

Mechanical stress induced by electromagnetic forces on wire bonds of high power modules
type: Distribution
format: HTML
issued: 2026-05-05T16:04:25.933951
modified: 2026-05-05T16:04:25.924630
access URL: https://hal.science/hal-00975195

test_moissonnage_selune
type: Agent