Architectured materials to improve the reliability of power electronics modules : substrate and lead-free solder
type: Distribution
access URL: https://minesparis-psl.hal.science/hal-00955777
format: HTML
issued: 2026-05-06T03:24:41.886680
modified: 2026-05-06T03:24:41.867647

test_moissonnage_selune
type: Agent

Architectured materials to improve the reliability of power electronics modules : substrate and lead-free solder
type: Dataset
contact point: Organization
  fn: CCSD
keyword: spimatengineering-sciences-physicsmaterials
keyword: intermetallics
keyword: lead-free-solder
keyword: snagcu-alloy
keyword: architectured-material
keyword: journal-articles
keyword: infoeu-reposemanticsarticle
keyword: substrate-with-thermal-bridges
landing page: 0361-5235
description: International audience
issued: 2026-05-06T03:24:41.878626
language: en
modified: 2026-05-06T03:24:41.878631